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ATP at Full Steam for Electronica 2016

2016-11-08Back

Taipei, Taiwan (November 8, 2016)  – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD.  New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash.  ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.

3D MLC/TLC NAND is primarily characterized for usage in big market SSD usage models in client and enterprise applications. 3D NAND utilization in embedded, industrial applications must be particularly characterized for many other conditions including data retention over temperature variance, cross temperature reliability, and read-only boot usage models among others. To be at the forefront of this technology shift, ATP has taken the initiative with major resource investment into characterization of 3D NAND in such conditions. To learn about these solutions, please visit the ATP Electronica booth at # A6-459.

In addition, at Electronica, a presentation titled “Optimizing Embedded SSDs: One size doesn’t fit all”, on the 9th of November, Wednesday, from 16:00 to 16:40 at Embedded Platforms Conference Track No. 2.7.

For more details about the latest ATP products and solutions, please contact your local ATP representatives, or email info@atpinc.com .

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