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News Release

  • 2017-03-07 ATP Reveals 3D NAND SSD product line at Embedded World 2017
    ATP reveals its new 3D NAND based SATA product line up on the Embedded World 2017
  • 2016-11-16 ATP at Full Steam for Embedded Technology 2016
    Taipei, Taiwan (November 16, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.
  • 2016-11-08 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-09-12 DDR4 ECC Mini-UDIMM, Now Joining ATP Mini DIMM Product Line
    The new DDR4 ECC VLP Mini-UDIMM is suited for high-performance applications requiring high density and better power efficiency consumption management, such application includes: Telecommunication infrastructure, networking systems, Micro/Cloud servers and Industrial PCs.
  • 2016-08-08 ATP Readies 3D NAND SSDs For Embedded Applications
    Taipei, Taiwan (August 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSata, SlimSata, 2.5” SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets. ATP will showcase these new solutions and related products at the Flash Memory Summit 2016 from August 9 to 11, at the Santa Clara Convention Center, meeting room #205.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP highlights Its Automotive Solutions at the EW2016
    In addition to introducing latest SATA III Product Family
  • 2015-11-09 ATP to Showcase Its Automotive Solution at Embedded Technology 2015
  • 2015-08-03 ATP Announces Agreement with Micron for Legacy (SDR/DDR) DRAM Module Support
    ATP Announces Agreement with Micron for Legacy (SDR/DDR) DRAM Module Support
  • 2016-11-16 ATP at Full Steam for Embedded Technology 2016
    Taipei, Taiwan (November 16, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products from Nov 16th to 18th at Embedded Technology 2016 in Yokohama, Japan. ATP booth will be located at # C-30-3.
  • 2016-11-08 ATP at Full Steam for Electronica 2016
    Taipei, Taiwan (November 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD. New product line displays include new industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. ATP will showcase these new solutions and related products at Electronica 2016 from November 8th to 11th, which takes place at the Messe München International Center Germany. ATP will be located at Hall A6, Booth # 459.
  • 2016-10-17 ATP Introduces Industry’s First DDR3L-1866 ECC SODIMM
    Well-suited for Intel Apollo Lake based IoT and embedded platforms, ATP's industry’s first DDR3L ECC SODIMM technology is capable of operating at 1866MHz.
  • 2016-09-12 DDR4 ECC Mini-UDIMM, Now Joining ATP Mini DIMM Product Line
    The new DDR4 ECC VLP Mini-UDIMM is suited for high-performance applications requiring high density and better power efficiency consumption management, such application includes: Telecommunication infrastructure, networking systems, Micro/Cloud servers and Industrial PCs.
  • 2016-08-08 ATP Readies 3D NAND SSDs For Embedded Applications
    Taipei, Taiwan (August 8, 2016) – ATP Electronics Inc., the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the latest 3D NAND flash technologies. Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSata, SlimSata, 2.5” SSD, eUSB and memory cards, provides a new level of product differentiation targeting the industrial and embedded markets. ATP will showcase these new solutions and related products at the Flash Memory Summit 2016 from August 9 to 11, at the Santa Clara Convention Center, meeting room #205.
  • 2016-03-28 ATP Furthers Support of Micron Legacy DRAM Modules
    Continues to manufacture SDR/DDR1 Modules on Micron EOL List
  • 2016-02-15 ATP highlights Its Automotive Solutions at the EW2016
    In addition to introducing latest SATA III Product Family

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